Chief Technology Officer (CTO) for the FlexTech Group and for SEMI's Advanced Packaging program
With over 20 years of experience in the semiconductor industry, Grupen-Shemansky has a strong background in R&D, manufacturing, business development, and technology strategy. She oversees FlexTech's flexible hybrid electronics (FHE) and Nano-Bio Manufacturing Consortium (NBMC) R&D programs and technology advisory councils. Grupen-Shemansky serves as technical advisor to SEMI's Advanced Packaging. Grupen-Shemansky held various management positions over ten years ─ in silicon and gallium arsenide device fabrication, packaging, interconnect and system integration for Motorola. Following Motorola, she was the director of Interconnect Technology and Design Engineering at Lucent, Bell Labs (Agere Systems), vice president of Packaging and Design at Spansion, and senior vice president of Engineering in Advanced Nanotechnology Solutions, a startup in 3D and cybersecurity.